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general description the max2022 low-noise, high-linearity, direct conversion quadrature modulator/demodulator is designed for single and multicarrier 1500mhz to 3000mhz umts/wcdma, lte/td-lte, cdma2000 ? , and dcs/pcs base-station applications. direct conversion architectures are advanta - geous since they significantly reduce transmitter or receiv - er cost, part count, and power consumption as compared to traditional if-based double conversion systems. in addition to offering excellent linearity and noise perfor - mance, the max2022 also yields a high level of component integration. this device includes two matched passive mix - ers for modulating or demodulating in-phase and quadra - ture signals, three lo mixer amplifier drivers, and an lo quadrature splitter. on-chip baluns are also integrated to allow for single-ended rf and lo connections. as an added feature, the baseband inputs have been matched to allow for direct interfacing to the transmit dac, thereby eliminating the need for costly i/q buffer amplifiers. the max2022 operates from a single +5v supply. it is available in a compact 36-pin tqfn package (6mm x 6mm) with an exposed paddle. electrical performance is guaranteed over the extended -40c to +85c tempera - ture range. applications single and multicarrier wcdma/umts, and lte/td- lte base stations single and multicarrier cdmaone? and cdma2000 base stations single and multicarrier dcs 1800/pcs 1900 edge base stations phs/pas base stations predistortion transmitters fixed broadband wireless access wireless local loop private mobile radio military systems microwave links digital and spread-spectrum communication systems benefts and features 1500mhz to 3000mhz rf frequency range 1500mhz to 3000mhz lo frequency range scalable power: external current-setting resistors provide option for operating device in reduced- power/reduced-performance mode 36-pin, 6mm x 6mm tqfn provides high isolation in a small package modulator operation: (2140mhz): meets four-carrier wcdma 65dbc aclr 23.3dbm typical oip3 51.5dbm typical oip2 45.7dbc typical sideband suppression -40dbm typical lo leakage -173.2dbm/hz typical output noise, eliminating the need for an rf output filter broadband baseband input dc-coupled input provides for direct launch dac interface, eliminating the need for costly i/q buffer amplifiers demodulator operation (1890mhz): 39dbm typical iip3 58dbm typical iip2 9.2db typical conversion loss 9.4db typical nf ordering information appears at end of data sheet. for related parts and recommended products to use with this part, refer to www.maximintegrated.com/max2022.related . cdma2000 is a registered trademark of telecommunications industry association. cdmaone is a trademark of cdma development group. wcdma, aclr, altclr and noise vs. rf output power at 2140mhz for single, two, and four carriers 19-3572; rev 1; 9/12 evaluation kit available rf output power per carrier (dbm ) aclr and alt clr (dbc ) -10 -20 -30 -40 -78 -76 -74 -72 -70 -68 -66 -64 -62 -60 -80 noise floor (dbm/hz) -165 -155 -145 -135 -125 -175 -50 0 4c adj 4c alt 2c adj 1c adj 2c alt 1c alt 4c 2c 1c noise floor max2022 high-dynamic-range, direct up/ downconversion 1500mhz to 3000mhz quadrature modulator/demodulator
maxim integrated 2 dc electrical characteristics (max2022 typical application circuit , v cc = 4.75v to 5.25v, v gnd = 0v, i/q ports terminated into 50? to gnd, lo and rf ports terminated into 50? to gnd, r1 = 432?, r2 = 562?, r3 = 301?, t c = -40c to +85c, unless otherwise noted. typical values are at v cc = +5v, t c = +25c, unless otherwise noted.) recommended ac operating conditions vcc_ to gnd ....................................................... -0.3v to +5.5v bbip, bbin, bbqp, bbqn to gnd .......... -2.5v to (v cc + 0.3v) lo, rf to gnd maximum current ..................................... 50ma rf input power .............................................................. +20dbm baseband differential i/q input power ........................... +20dbm lo input power .............................................................. +10dbm rbiaslo1 maximum current ............................................ 10ma rbiaslo2 maximum current ............................................ 10ma rbiaslo3 maximum current ............................................ 10ma continuous power dissipation (note 1) .............................. 7.6w operating case temperature range (note 2) ... -40c to +85c maximum junction temperature ..................................... +150c storage temperature range ............................ -65c to +150c lead temperature (soldering, 10s) ................................. +300c soldering temperature (reflow) ....................................... +260c stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. these are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. exposure to ab solute maximum rating conditions for extended periods may affect device reliability. package thermal characteristics tqfn junction-to-ambient thermal resistance ( ja ) (notes 3, 4) ..................... +34c/w junction-to-case thermal resistance ( jc ) (notes 1, 4) .................... +8.5c/w absolute maximum ratings note 1: based on junction temperature t j = t c + ( jc x v cc x i cc ). this formula can be used when the temperature of the exposed pad is known while the device is soldered down to a pcb. see the applications information section for details. the junction temperature must not exceed +150c. note 2: t c is the temperature on the exposed pad of the package. t a is the ambient temperature of the device and pcb. note 3: junction temperature t j = t a + ( ja x v cc x i cc ). this formula can be used when the ambient temperature of the pcb is known. the junction temperature must not exceed +150c. note 4: package thermal resistances were obtained using the method described in jedec specification jesd51-7, using a four-layer board. for detailed information on package thermal considerations, refer to www.maximintegrated.com/thermal-tutorial . parameter symbol conditions min typ max units supply voltage v cc 4.75 5.00 5.25 v total supply current i total pins 3, 13, 15, 31, 33 all connected to v cc 292 342 ma total power dissipation 1460 1796 mw parameter symbol conditions min typ max units rf frequency (note 5) f rf 1500 3000 mhz lo frequency (note 5) f lo 1500 3000 mhz if frequency (note 5) f if 1000 mhz lo power range p lo -3 +3 dbm max2022 high-dynamic-range, direct up/ downconversion 1500mhz to 3000mhz quadrature modulator/demodulator www.maximintegrated.com
maxim integrated 3 ac electrical characteristics (modulator) (max2022 typical application circuit , v cc = 4.75v to 5.25v, v gnd = 0v, i/q differential inputs driven from a 100? differential dc-coupled source, 0v common-mode input, p lo = 0dbm, f lo = 1900mhz to 2200mhz, 50? lo and rf system impedance, r1 = 432?, r2 = 562?, r3 = 301?, t c = -40c to +85c. typical values are at v cc = 5v, v bbi = 109mv p-p differential, v bbq = 109mv p-p differential, f iq = 1mhz, t c = +25c, unless otherwise noted.) (notes 6, 7) parameter symbol conditions min typ max units baseband input baseband input differential impedance 43 ? bb common-mode input voltage range (note 8) -2.5 0 +1.5 v output power t c = +25c -24 dbm rf outputs (f lo = 1960mhz) output ip3 v bbi , v bbq = 547mv p-p differential per tone into 50?, f bb1 = 1.8mhz, f bb2 = 1.9mhz 21.8 dbm output ip2 v bbi , v bbq = 547mv p-p differential per tone into 50?, f bb1 = 1.8mhz, f bb2 = 1.9mhz 48.9 dbm output power -20.5 dbm output power variation over temperature t c = -40c to +85c -0.004 db/c output-power flatness f lo = 1960mhz, sweep f bb , p rf fatness for f bb from 1mhz to 50mhz 0.6 db aclr (1st adjacent channel 5mhz offset) single-carrier wcdma (note 9), rfout = -16dbm 70 dbc lo leakage no external calibration, with each baseband input terminated in 50? to gnd -46.7 dbm sideband suppression no external calibration 47.3 dbc rf return loss 15.3 db output noise density f meas = 2060mhz (note 10) -173.4 dbm/hz lo input return loss 10.1 db rf outputs (f lo = 2140mhz) output ip3 v bbi , v bbq = 547mv p-p differential per tone into 50?, f bb1 = 1.8mhz, f bb2 = 1.9mhz 23.3 dbm output ip2 v bbi , v bbq = 547mv p-p differential per tone into 50?, f bb1 = 1.8mhz, f bb2 = 1.9mhz 51.5 dbm output power -20.8 dbm output power variation over temperature t c = -40c to +85c -0.005 db/c output-power flatness f lo = 2140mhz, sweep f bb , p rf fatness for f bb from 1mhz to 50mhz 0.32 db max2022 high-dynamic-range, direct up/ downconversion 1500mhz to 3000mhz quadrature modulator/demodulator www.maximintegrated.com
maxim integrated 4 ac electrical characteristics (modulator) (continued) (max2022 typical application circuit , v cc = 4.75v to 5.25v, v gnd = 0v, i/q differential inputs driven from a 100? differential dc-coupled source, 0v common-mode input, p lo = 0dbm, f lo = 1900mhz to 2200mhz, 50? lo and rf system impedance, r1 = 432?, r2 = 562?, r3 = 301?, t c = -40c to +85c. typical values are at v cc = 5v, v bbi = 109mv p-p differential, v bbq = 109mv p-p differential, f iq = 1mhz, t c = +25c, unless otherwise noted.) (notes 6, 7) ac electrical characteristics (demodulator, lo = 1880mhz) (max2022 typical application circuit when operated as a demodulator. i/q outputs are recombined using network shown in figure 5 . losses of combining network not included in measurements. rf and lo ports are driven from 50? sources. typical values are for v cc = 5v, i/q dc returns = 160? resistors to gnd, p rf = 0dbm, p lo = 0dbm, f rf = 1890mhz, f lo = 1880mhz, f if = 10mhz, t c = +25c, unless otherwise noted.) (notes 6, 11) parameter symbol conditions min typ max units aclr (1st adjacent channel 5mhz offset) single-carrier wcdma (note 9), rfout = -16dbm, f lo = 2ghz 70 dbc lo leakage no external calibration, with each baseband input terminated in 50? to gnd -40.4 dbm sideband suppression no external calibration 45.7 dbc rf return loss 13.5 db output noise density f meas = 2240mhz (note 10) -173.2 dbm/hz lo input return loss 18.1 db parameter symbol conditions min typ max units conversion loss l c 9.2 db noise figure nf ssb 9.4 db input third-order intercept point iip3 f rf1 = 1890mhz, f rf2 = 1891mhz, p rf1 = p rf2 = 0dbm, f if1 = 10mhz, f if2 = 11mhz 39 dbm input second-order intercept point iip2 f rf1 = 1890mhz, f rf2 = 1891mhz, p rf1 = p rf2 = 0dbm, f if1 = 10mhz, f if2 = 11mhz, f im2nd = 21mhz 58 dbm lo leakage at rf port unnulled -40 dbm gain compression p rf = 20dbm 0.10 db image rejection 35 db rf port return loss c9 = 1.2pf 17 db lo port return loss c3 = 22pf 9 db if port differential impedance 43 ? minimum demodulation 3db bandwidth >500 mhz minimum 1db gain flatness >450 mhz max2022 high-dynamic-range, direct up/ downconversion 1500mhz to 3000mhz quadrature modulator/demodulator www.maximintegrated.com
maxim integrated 5 note 5: recommended functional range, not production tested. operation outside this range is possible, but with degraded perfor - mance of some parameters. note 6: all limits include external component losses of components, pcb, and connectors. note 7: it is advisable not to operate the i and q inputs continuously above 2.5v p-p differential. note 8: guaranteed by design and characterization. note 9: single-carrier wcdma peak-to-average ratio of 10.5db for 0.1% complementary cumulative distribution function. note 10: no baseband drive input. measured with the baseband inputs terminated in 50 to gnd. at low-output power levels, the output noise density is equal to the thermal noise floor. note 11: it is advisable not to operate the rf input continuously above +17dbm. ac electrical characteristics (demodulator, lo = 2855mhz) (max2022 typical application circuit when operated as a demodulator. i/q outputs are recombined using network shown in figure 5 . losses of combining network not included in measurements. rf and lo ports are driven from 50? sources. typical values are for v cc = 5v, i/q dc returns = 160? resistors to gnd, p rf = 0dbm, p lo = 0dbm, f rf = 2655mhz, f lo = 2855mhz, f if = 200mhz, t c = +25c, unless otherwise noted.) (notes 6, 11) parameter symbol conditions min typ max units conversion loss l c 11.2 db noise figure nf ssb 11.4 db input third-order intercept point iip3 f rf1 = 2655mhz, f rf2 = 2656.2mhz, p rf1 = p rf2 = 0dbm, f if1 = 10mhz, f if2 = 198.8mhz 34.5 dbm input second-order intercept point iip2 f rf1 = 2655mhz, f rf2 = 2656.2mhz, p rf1 = p rf2 = 0dbm, f if1 = 200mhz, f if2 = 198.8mhz, f im2nd = 398.8mhz 60 dbm lo leakage at rf port -31.3 dbm lo leakage at if port i+ -25.2 dbm i- -23.5 q+ -26 q- -22.3 gain compression p rf = 20dbm 0.10 db i/q gain mismatch 0.3 db i/q phase mismatch 0.5 deg rf port return loss c9 = 22pf, l1 = 4.7nh, c14 = 0.7pf 22.5 db lo port return loss c3 = 6.8pf 14.2 db if port differential impedance 43 ? minimum demodulation 3db bandwidth >500 mhz minimum 1db gain flatness >450 mhz max2022 high-dynamic-range, direct up/ downconversion 1500mhz to 3000mhz quadrature modulator/demodulator www.maximintegrated.com
maxim integrated 6 typical operating characteristics (max2022 typical application circuit , 50? lo input, r1 = 432?, r2 = 562?, r3 = 301?, v cc = 5v, p lo = 0dbm, f lo = 2140mhz, v i = v q = 109mv p-p differential, f iq = 1mhz, i/q differential inputs driven from a 100? differential dc-coupled source, common-mode input from 0v, t c = +25c, unless otherwise noted.) modulator lo leakage vs. lo frequency max2022 toc09 lo frequency (ghz ) lo leakage (dbm) 2.3 2.1 1.9 1.7 -70 -50 -30 -10 -90 1.5 2.5 baseband inputs terminated in 50 v cc = 4.75v, 5.0v v cc = 5.25v lo leakage vs. lo frequency max2022 toc08 lo frequency (ghz ) lo leakage (dbm) 2.3 2.1 1.9 1.7 -70 -50 -30 -10 -90 1.5 2.5 baseband inputs terminated in 50 t c = -40c, +85c t c = +25c lo leakage vs. lo frequency max2022 toc07 lo frequency (ghz ) lo leakage (dbm) 2.3 2.1 1.9 1.7 -70 -50 -30 -10 -90 1.5 2.5 baseband inputs terminated in 50 p lo = -3dbm, +3dbm p lo = 0dbm output power vs. lo frequenc y max2022 toc06 lo frequency (ghz ) output power (dbm ) 2.3 2.1 1.9 1.7 -7 -6 -5 -4 -3 -2 -8 1.5 2.5 v i = v q = 0.611v p-p differentia l v cc = 4.75v, 5.0v, 5.25v output power vs. lo frequenc y max2022 toc05 lo frequency (ghz ) output power (dbm ) 2.3 2.1 1.9 1.7 -7 -6 -5 -4 -3 -2 -8 1.5 2.5 v i = v q = 0.611v p-p differentia l t c = +85c t c = +25c t c = -40c output power vs. lo frequenc y max2022 toc04 lo frequency (ghz ) output power (dbm ) 2.3 2.1 1.9 1.7 -7 -6 -5 -4 -3 -2 -8 1.5 2.5 v i = v q = 0.611v p-p differentia l p lo = -3dbm, 0dbm, +3dbm aclr vs. output power max2022 toc03 output power (dbm) aclr (db) -20 -30 -40 -50 -10 -78 -76 -74 -72 -70 -68 -66 -64 -62 -60 -80 adjacent channe l alternate channe l four carrier aclr vs. output power max2022 toc02 output power (dbm) aclr (db) -10 -20 -30 -40 0 -78 -76 -74 -72 -70 -68 -66 -64 -62 -60 -80 adjacent channe l alternate channe l two carrier aclr vs. output power max2022 toc01 output power (dbm) aclr (db) -10 -20 -30 -40 0 -78 -76 -74 -72 -70 -68 -66 -64 -62 -60 -80 adjacent channe l alternate channe l single carrier max2022 high-dynamic-range, direct up/ downconversion 1500mhz to 3000mhz quadrature modulator/demodulator www.maximintegrated.com
maxim integrated 7 typical operating characteristics (continued) (max2022 typical application circuit , 50? lo input, r1 = 432?, r2 = 562?, r3 = 301?, v cc = 5v, p lo = 0dbm, f lo = 2140mhz, v i = v q = 109mv p-p differential, f iq = 1mhz, i/q differential inputs driven from a 100? differential dc-coupled source, common-mode input from 0v, t c = +25c, unless otherwise noted.) modulator baseband differential input resistance vs. baseband frequenc y baseband differential input resistance () 43.0 43.5 44.0 44.5 42.5 max2022 toc18 baseband frequency (mhz) 60 40 80 20 0 100 f lo = 2ghz, v cc = 5.0v p lo = -3dbm p lo = +3dbm p lo = 0dbm baseband differential input resistance vs. baseband frequenc y baseband differential input resistance () 41.5 42.0 42.5 43.0 43.5 44.0 44.5 45.0 41.0 max2022 toc17 baseband frequency (mhz) 60 40 80 20 0 100 f lo = 2ghz, p lo = 0dbm v cc = 5.0v v cc = 4.75v v cc = 5.25v if flatness vs. baseband frequency max2022 toc16 baseband frequency (mhz) if power (dbm) 80 60 40 20 -23 -22 -21 -20 -19 -18 -17 -16 -15 -14 -24 0 100 f lo = 2140mhz, p bb = -12dbm/port into 50 f lo - f iq f lo + f iq if flatness vs. baseband frequency max2022 toc15 baseband frequency (mhz) if power (dbm) 80 60 40 20 -23 -22 -21 -20 -19 -18 -17 -16 -15 -14 -24 0 100 f lo = 1960mhz, p bb = -12dbm/port into 50 f lo - f iq f lo + f iq output noise vs. output power amx2022 toc14 output power (dbm ) output noise (dbm/hz) 5 0 -10 -5 -15 -20 -176 -172 -168 -164 -160 -156 -180 -25 10 p lo = 0dbm, f lo = 2140mhz t c = -40c t c = +85c t c = +25c output noise vs. output power amx2022 toc13 output power (dbm ) output noise (dbm/hz) 5 0 -10 -5 -15 -20 -175 -170 -165 -160 -155 -150 -180 -25 10 p lo = 0dbm, f lo = 1960mhz t c = +85c t c = -40c t c = +25c image rejection (db) 10 20 30 40 50 60 0 image rejection vs. lo frequency max2022 toc12 lo frequency (ghz ) 2.3 2.1 1.9 1.7 1.5 2.5 f bb = 1mhz, v i = v q = 112mv p-p v cc = 4.75, 5.0v, 5.25v image rejection (db) 10 20 30 40 50 60 0 image rejection vs. lo frequency max2022 toc11 lo frequency (ghz ) 2.3 2.1 1.9 1.7 1.5 2.5 f bb = 1mhz, v i = v q = 112mv p-p p lo = 0dbm p lo = +3dbm p lo = -3dbm image rejection (db) 10 20 30 40 50 60 0 image rejection vs. lo frequency max2022 toc10 lo frequency (ghz ) 2.3 2.1 1.9 1.7 1.5 2.5 f bb = 1mhz, v i = v q = 112mv p-p t c = -40c, +25c, +85c max2022 high-dynamic-range, direct up/ downconversion 1500mhz to 3000mhz quadrature modulator/demodulator www.maximintegrated.com
maxim integrated 8 typical operating characteristics (continued) (max2022 typical application circuit , 50? lo input, r1 = 432?, r2 = 562?, r3 = 301?, v cc = 5v, p lo = 0dbm, f lo = 2140mhz, v i = v q = 109mv p-p differential, f iq = 1mhz, i/q differential inputs driven from a 100? differential dc-coupled source, common-mode input from 0v, t c = +25c, unless otherwise noted.) modulator lo leakage vs. lo frequency max2022 toc27 lo frequency (ghz ) lo leakage (dbm) 1.970 1.965 1.960 1.955 1.950 -80 -60 -40 -20 0 -100 1.945 1.975 nulled at f lo = 1960mhz at p rf = -18dbm commmon-mode baseband voltage (v) 2 1 0 -1 -2 10 20 30 40 50 60 0 -3 3 output ip2 vs. common-mode baseband voltage max2022 toc26 oip2 (dbm) f lo = 2140mhz f lo = 1960mhz v bb = 0.61v p-p differential per tone , f bb1 = 1.8mhz, f bb2 = 1.9mhz 10 20 30 40 50 60 70 0 output ip2 vs. lo frequency max2022 toc25 lo frequency (ghz ) oip2 (dbm) 2.3 2.1 1.9 1.7 1.5 2.5 p lo = +3dbm p lo = 0dbm p lo = -3dbm v bb = 0.61v p-p differential per tone , f bb1 = 1.8mhz, f bb2 = 1.9mhz 10 20 30 40 50 60 70 0 output ip2 vs. lo frequency max2022 toc24 lo frequency (ghz ) oip2 (dbm) 2.3 2.1 1.9 1.7 1.5 2.5 v bb = 0.61v p-p differential per tone , f bb1 = 1.8mhz, f bb2 = 1.9mhz v cc = 4.75v, 5.0v v cc = 5.25v 10 20 30 40 50 60 70 0 output ip2 vs. lo frequency max2022 toc23 lo frequency (ghz ) oip2 (dbm) 2.3 2.1 1.9 1.7 1.5 2.5 v bb = 0.61v p-p differential per tone , f bb1 = 1.8mhz, f bb2 = 1.9mhz t c = +25c t c = +85c t c = -40c commmon-mode baseband voltage (v) 2 1 0 -1 -2 10 20 30 40 50 60 0 -3 3 output ip3 vs. common-mode baseband voltage max2022 toc22 oip3 (dbm) f lo = 2140mhz f lo = 1960mhz v bb = 0.61v p-p differential per tone , f bb1 = 1.8mhz, f bb2 = 1.9mhz output ip3 vs. lo frequency max2022 toc21 lo frequency (ghz ) oip3 (dbm) 2.3 2.1 1.9 1.7 5 10 15 20 25 0 1.5 2.5 v bb = 0.61v p-p differential per tone , f bb1 = 1.8mhz, f bb2 = 1.9mhz p lo = 0dbm, +3dbm p lo = -3dbm output ip3 vs. lo frequency max2022 toc20 lo frequency (ghz ) oip3 (dbm) 2.3 2.1 1.9 1.7 5 10 15 20 25 0 1.5 2.5 v bb = 0.61v p-p differential per tone , f bb1 = 1.8mhz, f bb2 = 1.9mhz v cc = 5.0v, 5.25v v cc = 4.75v output ip3 vs. lo frequency max2022 toc19 lo frequency (ghz ) oip3 (dbm) 2.3 2.1 1.9 1.7 5 10 15 20 25 0 1.5 2.5 t c = -40c, +25c, +85c v bb = 0.61v p-p differential per tone , f bb1 = 1.8mhz, f bb2 = 1.9mhz max2022 high-dynamic-range, direct up/ downconversion 1500mhz to 3000mhz quadrature modulator/demodulator www.maximintegrated.com
maxim integrated 9 typical operating characteristics (continued) (max2022 typical application circuit , 50? lo input, r1 = 432?, r2 = 562?, r3 = 301?, v cc = 5v, p lo = 0dbm, f lo = 2140mhz, v i = v q = 109mv p-p differential, f iq = 1mhz, i/q differential inputs driven from a 100? differential dc-coupled source, common-mode input from 0v, t c = +25c, unless otherwise noted.) modulator -25 -20 -15 -10 -5 0 -30 lo port match (db) lo port match vs. lo frequency max2022 toc36 lo frequency (ghz ) 2.3 2.1 1.9 1.7 1.5 2.5 v cc = 4.75v, 5.0v, 5.25v rf port match (db ) -15 -10 -5 0 -20 rf port match vs. lo frequency max2022 toc35 lo frequency (ghz ) 2.3 2.1 1.9 1.7 1.5 2.5 v cc = 4.75v, 5.0v, 5.25v sideband supression vs. p rf max2022 toc34 modulator p out (dbm) sideband suppression (db) -15 -20 -25 10 20 30 40 50 60 70 0 -30 -10 f bb1 = 1.8mhz, f bb2 = 9mhz, f lo = 2140mhz, 1.8mhz baseband tone nulled at p rf = -20dbm 1.8mhz 9mhz sideband supression vs. p rf max2022 toc33 modulator p out (dbm) sideband suppression (db) -15 -20 -25 10 20 40 30 50 60 70 0 -30 -10 f bb1 = 1.8mhz, f bb2 = 9mhz, f lo = 1960mhz, 1.8mhz baseband tone nulled at p rf = -20dbm 1.8mhz 9mhz lo leakage vs. differentia l dc offset on q-side max2022 toc32 dc differential offset on q-side (mv) lo leakage (dbm) -9 -10 -11 -12 -13 -14 -70 -60 -50 -40 -80 -15 -8 p rf = -18dbm, i-side nulled f lo = 2140mhz f lo = 1960mhz lo frequency (ghz ) 2.20 2.15 2.10 2.05 -80 -70 -60 -50 -40 -30 -20 -10 0 -90 2.00 2.25 lo leakage vs. f lo with lo leakage nulled at specific p rf lo leakage (dbm) f lo = 2140mhz, nulled at -10dbm p rf max2022 toc31 lo frequency (ghz ) 2.05 2.00 1.95 1.90 -80 -70 -60 -50 -40 -30 -20 -10 0 -90 1.85 2.10 lo leakage vs. f lo with lo leakage nulled at specific p rf lo leakage (dbm) f lo = 1960mhz, nulled at -10dbm p rf max2022 toc30 lo leakage vs. p rf with lo leakage nulled at specific p rf max2022 toc29 output power p rf (dbm) lo leakage (dbm) -20 -30 -25 -15 -35 -88 -86 -84 -82 -80 -78 -76 -74 -72 -70 -68 -90 -40 -10 f lo = 2140hz nulled at -10db m nulled at -14dbm, -18dbm, -22dbm lo leakage vs. p rf with lo leakage nulled at specific p rf max2022 toc28 output power p rf (dbm) lo leakage (dbm) -20 -30 -25 -15 -35 -88 -86 -84 -82 -80 -78 -76 -74 -72 -70 -68 -90 -40 -10 f lo = 1960mhz nulled at -10db m nulled at -14dbm, -18dbm, -22dbm max2022 high-dynamic-range, direct up/ downconversion 1500mhz to 3000mhz quadrature modulator/demodulator www.maximintegrated.com
maxim integrated 10 typical operating characteristics (continued) (max2022 typical application circuit , 50? lo input, r1 = 432?, r2 = 562?, r3 = 301?, v cc = 5v, p lo = 0dbm, f lo = 2140mhz, v i = v q = 109mv p-p differential, f iq = 1mhz, i/q differential inputs driven from a 100? differential dc-coupled source, common-mode input from 0v, t c = +25c, unless otherwise noted.) modulator 45 50 55 60 65 70 40 vccloq2 supply current vs. temperature (t c ) max2022 toc45 temperature (c) vccloq2 supply current (ma) 60 35 10 -15 -40 85 v cc = 5.25v v cc = 4.75v v cc = 5.0v vccloq1 supply current vs. temperature (t c ) max2022 toc44 temperature (c) vccloq1 supply current (ma) 60 35 10 -15 35 40 45 50 55 30 -40 85 v cc = 5.25v v cc = 4.75v v cc = 5.0v 45 50 55 60 65 70 40 vccloi2 supply current vs. temperature (t c ) max2022 toc43 temperature (c) vccloi2 supply current (ma) 60 35 10 -15 -40 85 v cc = 5.25v v cc = 4.75v v cc = 5.0v vccloi1 supply current vs. temperature (t c ) max2022 toc42 temperature (c) vccloi1 supply current (ma) 60 35 10 -15 35 40 45 50 55 30 -40 85 v cc = 5.25v v cc = 4.75v v cc = 5.0v 65 70 75 80 85 90 60 vccloa supply curren t vs. temperature (t c ) max2022 toc41 temperature (c) vccloa supply current (ma) 60 35 10 -15 -40 85 v cc = 5.25v v cc = 4.75v v cc = 5.0v total supply current vs. temperature (t c ) max2022 toc40 temperature (c) total supply current (ma) 60 35 10 -15 260 280 300 320 340 240 -40 85 v cc = 5.25v v cc = 4.75v v cc = 5.0v output power vs. input power (p in *) max2022 toc39 input power (p in *) (dbm) output power (dbm ) 13 8 3 -8 -6 -4 -2 0 2 4 6 8 10 -10 -2 18 p lo = 2140mhz *p in is the availabl e power from one of the four 50 baseband sources t c = -40c, +25c, +85c output power vs. input power (p in *) max2022 toc38 input power (p in *) (dbm) output power (dbm ) 13 8 3 -8 -6 -4 -2 0 2 4 6 8 10 -10 -2 18 f lo = 1960mhz *p in is the availabl e power from one of the four 50 baseband sources t c = -40c, +25c, +85c -45 -40 -35 -30 -25 -20 -15 -10 -5 0 -50 lo port match (db) lo port match vs. lo frequency max2022 toc37 lo frequency (ghz ) 2.3 2.1 1.9 1.7 1.5 2.5 p lo = -3dbm p lo = +3dbm p lo = 0dbm max2022 high-dynamic-range, direct up/ downconversion 1500mhz to 3000mhz quadrature modulator/demodulator www.maximintegrated.com
maxim integrated 11 pin description pin confguration/functional diagram pin name function 1, 5, 9C12, 14, 16C19, 22, 24, 27C30, 32, 34, 35, 36 gnd ground 2 rbiaslo3 3rd lo amplifer bias. connect a 301? resistor to ground. 3 vccloa lo input buffer amplifer supply voltage 4 lo local oscillator input. 50? input impedance. 6 rbiaslo1 1st lo input buffer amplifer bias. connect a 432? resistor to ground. 7 n.c. no internal connection and can be connected to ground or left open. 8 rbiaslo2 2nd lo amplifer bias. connect a 562? resistor to ground. 13 vccloi1 i-channel 1st lo amplifer supply voltage 15 vccloi2 i-channel 2nd lo amplifer supply voltage 20 bbip baseband in-phase positive input 1 2 3 4 5 6 7 8 9 10 11 12 13 14 tqfn (6mm x 6mm) 15 16 17 18 27 26 25 24 23 22 21 20 19 36 35 34 33 32 31 30 29 28 bias lo2 bias lo1 90 0 bias lo3 gnd bbip bbin gnd ep rf gnd bbqn bbqp gnd gnd gnd gnd gnd gnd gnd gnd gnd gnd + rbiaslo3 to p view vccloa lo gnd rbiaslo1 n.c. rbiaslo2 gnd gnd gnd vccloq2 gnd gnd gnd gnd max2022 vccloi1 vccloi1 vccloq1 max2022 high-dynamic-range, direct up/ downconversion 1500mhz to 3000mhz quadrature modulator/demodulator www.maximintegrated.com
maxim integrated 12 pin description (continued) detailed description the max2022 is designed for upconverting differential in-phase (i) and quadrature (q) inputs from baseband to a 1500mhz to 3000mhz rf frequency range. the device can also be used as a demodulator, downconverting an rf input signal directly to baseband or an if frequency. applications include single and multicarrier 1500mhz to 3000mhz umts/wcdma, lte/td-lte, cdma2000, and dcs/pcs base stations. direct conversion architec - tures are advantageous since they significantly reduce transmitter or receiver cost, part count, and power con - sumption as compared to traditional if-based double- conversion systems. the max2022 integrates internal baluns, an lo buffer, a phase splitter, two lo driver amplifiers, two matched dou - ble-balanced passive mixers, and a wideband quadrature combiner. precision matching between the in-phase and quadrature channels, and highly linear mixers achieves excellent dynamic range, aclr, 1db compression point, and lo and sideband suppression, making it ideal for four-carrier wcdma/umts operation. lo input balun, lo buffer, and phase splitter the max2022 requires a single-ended lo input, with a nominal power of 0dbm. an internal low-loss balun at the lo input converts the single-ended lo signal to a differential signal at the lo buffer input. in addition, the internal balun matches the buffers input impedance to 50? over the entire band of operation. the output of the lo buffer goes through a phase splitter, which generates a second lo signal that is shifted by 90 with respect to the original. the 0 and 90 lo signals drive the i and q mixers, respectively. lo driver following the phase splitter, the 0 and 90 lo signals are each amplified by a two-stage amplifier to drive the i and q mixers. the amplifier boosts the level of the lo signals to compensate for any changes in lo drive levels. the two-stage lo amplifier allows a wide input power range for the lo drive. while a nominal lo power of 0dbm is specified, the max2022 can tolerate lo level swings from -3dbm to +3dbm. i/q modulator the max2022 modulator is composed of a pair of matched double-balanced passive mixers and a balun. the i and q differential baseband inputs accept signals from dc to beyond 500mhz with differential amplitudes up to 2v p-p differential (common-mode input equals 0v). the wide input bandwidth allows for direct interface with the baseband dacs. no active buffer circuitry between the baseband dac and the max2022 is required. the i and q signals directly modulate the 0 and 90 lo signals and are upconverted to the rf frequency. the outputs of the i and q mixers are combined through a balun to a singled-ended rf output. applications information lo input drive the lo input of the max2022 requires a single-ended drive at a 1500mhz to 3000mhz frequency. it is internally matched to 50?. an integrated balun converts the single- ended input signal to a differential signal at the lo buffer differential input. an external dc-blocking capacitor is the only external part required at this interface. the lo input power should be within the -3dbm to +3dbm range. pin name function 21 bbin baseband in-phase negative input 23 rf rf port 25 bbqn baseband quadrature negative input 26 bbqp baseband quadrature positive input 31 vccloq2 q-channel 1st lo amplifer supply voltage 33 vccloq1 q-channel 2nd lo amplifer supply voltage ep gnd exposed ground paddle. the exposed paddle must be soldered to the ground plane using multiple vias. max2022 high-dynamic-range, direct up/ downconversion 1500mhz to 3000mhz quadrature modulator/demodulator www.maximintegrated.com
maxim integrated 13 modulator baseband i/q input drive the max2022 i and q baseband inputs should be driven differentially for best performance. the baseband inputs have a 50? differential input impedance. the optimum source impedance for the i and q inputs is 100? differen - tial. this source impedance will achieve the optimal signal transfer to the i and q inputs, and the optimum output rf impedance match. the max2022 can accept input power levels of up to +12dbm on the i and q inputs. operation with complex waveforms, such as cdma or wcdma carriers, utilize input power levels that are far lower. this lower power operation is made necessary by the high peak-to-average ratios of these complex waveforms. the peak signals must be kept below the compression level of the max2022. the input common-mode voltage should be confined to the -2v to +1.5v dc range. the max2022 is designed to interface directly with maxim high-speed dacs. this generates an ideal total transmit - ter lineup, with minimal ancillary circuit elements. such dacs include the max5875 series of dual dacs, and the max5895 dual interpolating dac. these dacs have ground-referenced differential current outputs. typical termination of each dac output into a 50? load resistor to ground, and a 10ma nominal dc output current results in a 0.5v common-mode dc level into the modulator i/q inputs. the nominal signal level provided by the dacs will be in the -12dbm range for a single cdma or wcdma carrier, reducing to -18dbm per carrier for a four-carrier application. the i/q input bandwidth is greater than 50mhz at -0.1db response. the direct connection of the dac to the max2022 insures the maximum signal fidelity, with no performance-limiting baseband amplifiers required. the dac output can be passed through a lowpass filter to remove the image frequencies from the dacs output response. the max5895 dual interpolating dac can be operated at interpolation rates up to x8. this has the ben - efit of moving the dac image frequencies to a very high, remote frequency, easing the design of the baseband filters. the dacs output noise floor and interpolation filter stopband attenuation are sufficiently good to insure that the 3gpp noise floor requirement is met for large frequency offsets, 60mhz for example, with no filtering required on the rf output of the modulator. figure 1 illustrates the ease and efficiency of interfac - ing the max2022 with a maxim dac, in this case the max5895 dual 16-bit interpolating-modulating dac. the max5895 dac has programmable gain and dif - ferential offset controls built in. these can be used to optimize the lo leakage and sideband suppression of the max2022 quadrature modulator. figure 1. max5895 dac interfaced with max2022 max5895 dual 16-bit interp dac max2022 rf modulator i/q gain and offset adjust bbi lo bbq freq 50 50 50 freq 50 50 rf 50 0 90 max2022 high-dynamic-range, direct up/ downconversion 1500mhz to 3000mhz quadrature modulator/demodulator www.maximintegrated.com
maxim integrated 14 rf output the max2022 utilizes an internal passive mixer architec - ture. this enables a very low noise floor of -173.2dbm/hz for low-level signals, below about -20dbm output power level. for higher output level signals, the noise floor will be determined by the internal lo noise level at approxi - mately -162dbc/hz. the i/q input power levels and the insertion loss of the device will determine the rf output power level. the input power is the function of the delivered input i and q voltag - es to the internal 50? termination. for simple sinusoidal baseband signals, a level of 89mv p-p differential on the i and the q inputs results in an input power level of -17dbm delivered to the i and q internal 50? terminations. this results in a -23.5dbm rf output power. generation of wcdma carriers the max2022 quadrature modulator makes an ideal sig - nal source for the generation of multiple wcdma carriers. the combination of high oip3 and exceptionally low out - put noise floor gives an unprecedented output dynamic range. the output dynamic range allows the generation of four wcdma carriers in the umts band with a noise floor sufficiently low to meet the 3gpp specification require - ments with no additional rf filtering. this promotes an extremely simple and efficient transmitter lineup. figure 2 illustrates a complete transmitter lineup for a multicarrier wcdma transmitter in the umts band. the max5895 dual interpolating-modulating dac is operated as a baseband signal generator. for genera - tion of four carriers of wcdma modulation, and digital predistortion, an input data rate of 61.44 or 122.88mbps can be used. the dac can then be programmed to operate in x8 or x4 interpolation mode, resulting in a 491.52msps output sample rate. the dac will gener - ate four carriers of wcdma modulation with an aclr typically greater than 77db under these conditions. the output power will be approximately -18dbm per carrier, with a noise floor typically less than -144dbc/hz. the max5895 dac has built-in gain and offset fine adjustments. these are programmable by a 3-wire serial logic interface. the gain adjustment can be used to adjust the relative gains of the i and q dac outputs. this feature can be used to improve the native sideband suppression of the max2022 quadrature modulator. the gain adjust - ment resolution of 0.01db allows sideband nulling down to approximately -60db. the offset adjustment can simi - larly be used to adjust the offset dc output of each i and q dac. these offsets can then be used to improve the native lo leakage of the max2022. the dac resolution of 4 lsbs will yield nulled lo leakage of typically less than -50dbc relative to four-carrier output levels. figure 2. complete transmitter lineup for a multicarrier wcdma in the umts band max5895 max2022 rf-modulator max2057 tx output +12db l-c filter i/q gain and offset adjust i i q q clock synth max2022 high-dynamic-range, direct up/ downconversion 1500mhz to 3000mhz quadrature modulator/demodulator www.maximintegrated.com
maxim integrated 15 the dac outputs must be filtered by baseband filters to remove the image frequency signal components. the baseband signals for four-carrier operation cover dc to 10mhz. the image frequency appears at 481mhz to 491mhz. this very large frequency spread allows the use of very low-complexity lowpass filters, with excellent in-band gain and phase performance. the low dac noise floor allows for the use of a very wideband filter, since the filter is not necessary to meet the 3gpp noise floor specification. the max2022 quadrature modulator then upconverts the baseband signals to the rf output frequency. the output power of the max2022 will be approximately -28dbm per carrier. the noise floor will be less than -169dbm/hz, with an aclr typically greater than 65dbc. this perfor - mance meets the 3gpp specification requirements with substantial margins. the noise floor performance will be maintained for large offset frequencies, eliminating the need for subsequent rf filtering in the transmitter lineup. the rf output from the max2022 is then amplified by a combination of a low-noise amplifier followed by a max2057 rf-vga. this vga can be used for lineup compensation for gain variance of transmitter and power amplifier elements. no significant degradation of the signal or noise levels will be incurred by this additional amplification. the max2057 will deliver an output power of -6dbm per carrier, 0dbm total at an aclr of 65db and noise floor of -142dbc/hz. external diplexer lo leakage at the rf port can be nulled to a level less than -80dbm by introducing dc offsets at the i and q ports. however, this null at the rf port can be compro - mised by an improperly terminated i/q interface. care must be taken to match the i/q ports to the external circuitry. without matching, the los second-order term (2f lo ) it may reflect back into the modulators i/q ports where it can remix with the internal lo signal to produce additional lo leakage at the rf output. this reflection effectively counteracts against the lo nulling. in addi - tion, the lo signal reflected at the i/q if port produces a residual dc term that can disturb the nulling condition. as demonstrated in figure 3 , providing an rc termination on each of the i+, i-, q+, q- ports reduces the amount of lo leakage present at the rf port under varying tempera - ture, lo frequency, and baseband termination conditions. see the typical operating characteristics for details. note that the resistor value is chosen to be 50? with a corner frequency 1 / (2?rc) selected to adequately filter the f lo and 2f lo leakage, yet not affecting the flatness of the baseband response at the highest baseband frequency. the common-mode f lo and 2f lo signals at i+/i- and q+/q- effectively see the rc networks and thus become terminated in 25? (r/2). the rc network provides a path for absorbing the 2f lo and f lo leakage, while the induc - tor provides high impedance at f lo and 2f lo to help the diplexing process. figure 3. diplexer network recommended for umts transmitter applications max2022 rf modulator lo rf 50 50 l = 11nh c = 2.2pf l = 11nh i q 50 50 c = 2.2pf c = 2.2pf 0 90 max2022 high-dynamic-range, direct up/ downconversion 1500mhz to 3000mhz quadrature modulator/demodulator www.maximintegrated.com
maxim integrated 16 rf demodulator the max2022 can also be used as an rf demodulator (see figure 4 ), downconverting an rf input signal directly to baseband. the single-ended rf input accepts signals from 1500mhz to 3000mhz. the passive mixer architec - ture produces a conversion loss of typically 9.2db and a noise figure of 9.4db. the downconverter is optimized for high linearity of typically +39dbm iip3. a wide i/q port bandwidth allows the port to be used as an image-reject mixer for downconversion to a quadrature if frequency. the rf and lo inputs are internally matched to 50?. thus, no matching components are required, and only dc-blocking capacitors are needed for interfacing. demodulator output port considerations much like in the modulator case, the four baseband ports require some form of dc return to establish a common mode that the on-chip circuitry drives. this is achieved by directly dc-coupling to the baseband ports (staying within the -2.5v to +1.5v common-mode range), through an inductor to ground, or through a low-value resistor to ground. figure 6 shows a typical network that would be used to connect to each baseband port for demodulator operation. this network provides a common-mode dc return, implements a high-frequency diplexer to terminate unwanted rf terms, and also provides an impedance transformation to a possible higher impedance baseband amplifier. the network c a , r a , l a , and c b form a highpass/lowpass network to terminate the high frequencies into a load while passing the desired lower if frequencies. elements l a , c b , l b , c c , l c , and c d provide a possible impedance transformer. depending on the impedance being trans - formed and the desired bandwidth, a fewer number of ele - ments can be used. it is suggested that l a and c b always be used since they are part of the high-frequency diplexer. if power matching is not a concern, then this reduces the elements to just the diplexer. figure 4. max2022 demodulator configuration figure 5. demodulator combining diagram adc 90 0 rf lo max2022 diplexer / dc return matchin g adc diplexer / dc return matchin g 3db pad dc bloc k0 3db pad dc block 180 mini-circuits zfsc-2-1w-s+ 0 combiner 3db pads look like 160 to ground and provides the common-mode dc return for the on-chip circuitry. i+ i- 3db pad dc bloc k 0 3db pad dc bloc k 180 mini-circuits zfscj-2-1 mini-circuits zfscj-2-1 q+ q- 90 max2022 high-dynamic-range, direct up/ downconversion 1500mhz to 3000mhz quadrature modulator/demodulator www.maximintegrated.com
maxim integrated 17 resistor r b provides a dc return to set the common- mode voltage. in this case, due to the on-chip circuitry, the voltage is approximately 0v dc. it can also be used to reduce the load impedance of the next stage. inductor l d can provide a bit of high-frequency gain peaking for wideband if systems. capacitor c e is a dc block. typical values for c a , r a , l a , and c b would be 1.5pf, 50?, 11nh, and 4.7pf, respectively. these values can change depending on the lo, rf, and if frequencies used. resistor r b is in the 50? to 200? range. the circuitry presented in figure 6 does not allow for lo leakage at rf port nulling. depending on the lo at rf leakage requirement, a trim voltage may need to be introduced on the baseband ports to null the lo leakage. power scaling with changes to the bias resistors bias currents for the lo buffers are optimized by fine tun - ing resistors r1, r2, and r3. maxim recommends using 1%-tolerance resistors; however, standard 5% values can be used if the 1% components are not readily avail - able. the resistor values shown in the typical application circuit were chosen to provide peak performance for the entire 1500mhz to 3000mhz band. if desired, the current can be backed off from this nominal value by choosing different values for r1, r2, and r3. contact the factory for additional details. layout considerations a properly designed pcb is an essential part of any rf/microwave circuit. keep rf signal lines as short as possible to reduce losses, radiation, and induc - tance. for the best performance, route the ground pin traces directly to the exposed pad under the pack - age. the pcb exposed paddle must be connected to the ground plane of the pcb. it is suggested that multiple vias be used to connect this pad to the lower- level ground planes. this method provides a good rf/ thermal conduction path for the device. solder the exposed pad on the bottom of the device package to the pcb. the max2022 evaluation kit can be used as a reference for board layout. gerber files are available upon request at www.maximintegrated.com . power-supply bypassing proper voltage-supply bypassing is essential for high- frequency circuit stability. bypass all v cc pins with 22pf and 0.1f capacitors placed as close to the pins as pos - sible. the smallest capacitor should be placed closest to the device. to achieve optimum performance, use good voltage- supply layout techniques. the max2022 has several rf processing stages that use the various v cc pins, and while they have on-chip decoupling, off-chip interaction between them may degrade gain, linearity, carrier sup - pression, and output power-control range. excessive coupling between stages may degrade stability. exposed pad rf/thermal considerations the ep of the max2022s 36-pin thin qfn-ep package provides a low thermal-resistance path to the die. it is important that the pc board on which the ic is mounted be designed to conduct heat from this contact. in addition, the ep provides a low-inductance rf ground path for the device. the exposed paddle (ep) must be soldered to a ground plane on the pc board either directly or through an array of plated via holes. an array of 9 vias, in a 3 x 3 array, is suggested. soldering the pad to ground is critical for efficient heat transfer. use a solid ground plane wherever possible. figure 6. baseband port typical filtering and dc return network externa l stag e l a r a c b c c c d c a l b r b l c l d c e max202 2 i/q output s max2022 high-dynamic-range, direct up/ downconversion 1500mhz to 3000mhz quadrature modulator/demodulator www.maximintegrated.com
maxim integrated 18 table 1. component list referring to the typical application circuit package information for the latest package outline information and land patterns (footprints), go to www.maximintegrated.com/packages . note that a +, #, or - in the package code indicates rohs status only. package drawings may show a different suffix character, but the drawing pertains to the package regardless of rohs status. chip information process: sige bicmos +denotes a lead(pb)-free/rohs-compliant package. **ep = exposed pad. t = tape and reel. ordering information component value description c1, c6, c7, c10, c13 22pf 22pf 5%, 50v c0g ceramic capacitors (0402) c2, c5, c8, c11, c12 0.1f 0.1f 10%, 16v x7r ceramic capacitors (0603) c3 22pf 22pf 5%, 50v c0g ceramic capacitor (0402), lo = 1500mhz to 2400mhz 6.8pf 6.8pf 5%, 50v c0g ceramic capacitor (0402), lo = 2400mhz to 3000mhz c9 1.2pf 1.2pf 0.1pf, 50v c0g ceramic capacitor (0402), rf = 1500mhz to 2400mhz 22pf 22pf 5%, 50v c0g ceramic capacitor (0402), rf = 2400mhz to 3000mhz c16 short replace with a short circuit or 0? resistor (0402), rf = 1500mhz to 2400mhz 0.7pf 0.7pf 0.1pf, 50v c0g ceramic capacitor (0402), rf = 2400mhz to 3000mhz l1 not used not installed for rf = 1500mhz to 2400mhz 4.7nh 4.7nh 0.3nh inductor (0402) for rf = 2400mhz to 3000mhz r1 432? 432? 1% resistor (0402) r2 562? 562? 1% resistor (0402) r3 301? 301? 1% resistor (0402) package type package code outline no. land pattern no. tqfn t3666+2 21-0141 90-0049 part temp range pin-package max2022etx+ -40c to +85c 36 tqfn-ep* (6mm x 6mm) max2022etx+t -40c to +85c 36 tqfn-ep* (6mm x 6mm) max2022 high-dynamic-range, direct up/ downconversion 1500mhz to 3000mhz quadrature modulator/demodulator www.maximintegrated.com
maxim integrated 19 typical application circuit 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 27 26 25 24 23 22 21 20 19 36 35 34 33 32 31 30 29 28 bias lo2 bias lo1 90 0 bias lo3 gnd bbip bbin gnd rf rf l1 gnd bbqn bbqp q+ q- gnd i- i+ c9 c16 c8 0.1f v cc c7 22pf c5 0.1f c6 22pf v cc gnd gnd gnd gnd vccloi1 vccloi2 gndg nd gnd gnd gnd rbiaslo3 r3 301 c1 22pf c3 c2 0.1f v cc vccloa lo lo gnd rbiaslo1 r1 432 n.c. rbiaslo2 c11 0.1f v cc c10 22pf c12 0.1f c13 22pf v cc gnd gnd gnd vccloq2 gnd gnd gnd gnd max2022 vccloq1 r2 562 ep max2022 high-dynamic-range, direct up/ downconversion 1500mhz to 3000mhz quadrature modulator/demodulator www.maximintegrated.com
? 2012 maxim integrated products, inc. 20 revision history revision number revision date description pages changed 0 4/05 initial release 1 9/12 update benefts and features, ordering info, applications, absolute maximum ratings; add new electrical characteristics tables, fgures, and new sections. 1C19 maxim cannot assume responsibility for use of any circuitry other than circuitry entirely embodied in a maxim product. no circuit patent licenses are implied. maxim reserves the right to change the circuitry and specifcations without notice at any time. the parametric values (min and max limits) shown in the electrical character - istics table are guaranteed. other parametric values quoted in this data sheet are provided for guidance. maxim integrated and the maxim integrated logo are trademarks of maxim integrated products, inc. max2022 high-dynamic-range, direct up/ downconversion 1500mhz to 3000mhz quadrature modulator/demodulator for pricing, delivery, and ordering information, please contact maxim direct at 1-888-629-4642, or visit maxims website at www.maximintegrated.com.

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